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The original message has been attached to this so you can view it or label similar future email. If you have any questions, see the administrator of that system for details. Content preview: Relevant information: Comparative Evaluation of Thermal Interface Materials for Improving the Thermal Contact between an Operating Computer Microprocessor and Its Heat Sink TIMOTHY A. HOWE,1 CHIA-KEN LEONG,1 and D.D.L. CHUNG1,2 Content analysis details: (3.6 points, 5.0 required) pts rule name description ---- ---------------------- -------------------------------------------------- 0.8 BAYES_50 BODY: Bayes spam probability is 40 to 60% [score: 0.4994] -0.0 SPF_PASS SPF: sender matches SPF record -0.0 SPF_HELO_PASS SPF: HELO matches SPF record 0.0 T_KAM_HTML_FONT_INVALID BODY: Test for Invalidly Named or Formatted Colors in HTML 0.0 HTML_MESSAGE BODY: HTML included in message -0.1 DKIM_VALID_AU Message has a valid DKIM or DK signature from author's domain -0.1 DKIM_VALID Message has at least one valid DKIM or DK signature -0.1 DKIM_VALID_EF Message has a valid DKIM or DK signature from envelope-from domain 0.1 DKIM_SIGNED Message has a DKIM or DK signature, not necessarily valid 3.0 AC_FROM_MANY_DOTS Multiple periods in From user name 0.0 T_REMOTE_IMAGE Message contains an external image --TdcvMWIae5JVQX9IQYKu1yUOrJ2CCq Content-type: text/plain; charset="UTF-8" Content-transfer-encoding: 8bit Relevant information: Comparative Evaluation of Thermal Interface Materials for Improving the Thermal Contact between an Operating Computer Microprocessor and Its Heat Sink TIMOTHY A. HOWE,1 CHIA-KEN LEONG,1 and D.D.L. CHUNG1,2 1.Composite Materials Research Laboratory, University at Buffalo, State University of New York, Buffalo, NY 14260-4400. 2.E-mail: ddlchung@buffalo.edu Testing of the relative effectiveness of various thermal interface materials for improving the thermal contact between the well-aligned mating surfaces of an operating computer microprocessor (with an integrated heat spreader) and its heat sink shows that carbon black paste, whether by itself or as a coating on aluminum or flexible graphite, is more effective than silver paste (Arctic Silver), but is comparable in effectiveness to aluminum paste (Shin-Etsu). The carbon black paste by itself is as effective as the Shin-Etsu paste coated aluminum. The Shin-Etsu paste is more effective than Arctic Silver, whether by itself or as a coating. The relative performance is mostly consistent with that assessed by measuring the thermal contact conductance. The correlation is particularly strong for conductance below 3 3 104 W/m2 C. The discrepancy is attributed to the difference in surface roughness between computer and guarded hot plate surfaces. In the case in which the mating surfaces of microprocessor and heat sink are not well aligned, Shin-Etsu and Arctic Silver are more effective than carbon black. - Cited http://citeseerx.ist.psu.edu/ (http://citeseerx.ist.psu.edu) Information Release Hey Lojban, The relentless spread of COVID continues. Social distancing is critical right now. This med-tier thermometer (http://portal.motorsportstas.com/template.html) can test anyone's body temperature without making contact. Keep your risk of contamination low. ** THE THERMOMETER------------------------------------------------------------ (http://portal.motorsportstas.com/template.html) ** IN USE BY OFFICIALS------------------------------------------------------------ (http://portal.motorsportstas.com/template.html) They are recently back in so now is the time to grab one. Get one right away before they are gone again. Get One Before They Are Gone (http://portal.motorsportstas.com/template.html) * Hello from: Cranston Illuminated Pub - 38 Thunder RD Miller Place | Ny, 11764 Click to adjust prefs (http://ns.motorsportstas.com/citations.html) or just mail. --TdcvMWIae5JVQX9IQYKu1yUOrJ2CCq Content-Type: text/html; charset="UTF-8" Content-transfer-encoding: 8bit
Relevant information: Comparative Evaluation of Thermal Interface Materials for Improving the Thermal Contact between an Operating Computer Microprocessor and Its Heat Sink

TIMOTHY A. HOWE,1 CHIA-KEN LEONG,1 and D.D.L. CHUNG1,2

1.Composite Materials Research Laboratory, University at Buffalo, State University of New York, Buffalo, NY 14260-4400. 2.E-mail: ddlchung@buffalo.edu

Testing of the relative effectiveness of various thermal interface materials for improving the thermal contact between the well-aligned mating surfaces of an operating computer microprocessor (with an integrated heat spreader) and its heat sink shows that carbon black paste, whether by itself or as a coating on aluminum or flexible graphite, is more effective than silver paste (Arctic Silver), but is comparable in effectiveness to aluminum paste (Shin-Etsu). The carbon black paste by itself is as effective as the Shin-Etsu paste coated aluminum. The Shin-Etsu paste is more effective than Arctic Silver, whether by itself or as a coating. The relative performance is mostly consistent with that assessed by measuring the thermal contact conductance. The correlation is particularly strong for conductance below 3 3 104 W/m2 C. The discrepancy is attributed to the difference in surface roughness between computer and guarded hot plate surfaces. In the case in which the mating surfaces of microprocessor and heat sink are not well aligned, Shin-Etsu and Arctic Silver are more effective than carbon black.

- Cited http://citeseerx.ist.psu.edu/
Information Release

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